BS EN 60191-6-2:2002

Действует

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages — 14 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

BS IEC 60191-2:1966

Действует

Mechanical standardization of semiconductor devices. Dimensions — 1052 стр.

BS EN 60191-6-8:2001

Действует

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP) — 14 стр.

На этот документ ссылаются

BS EN 62137:2004

Заменен

Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN — 30 стр.

ÖVE/ÖNORM EN 60191-6-19:2010-11

Действует

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010) (english version)

ÖVE/ÖNORM EN 62137-4:2015-09

Действует

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014) (english version)