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BS EN 60749-20:2009

Действует
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat — 30 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60068-2-20:2008 ed5.0
Заменен
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads — 40 стр.
IEC 60749-35:2006 ed1.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components — 43 стр.
BS EN 60068-2-20:2008
Действует
Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads — 22 стр.
BS EN 60749-3:2002
Заменен
Semiconductor devices. Mechanical and climatic test methods. External visual examination — 8 стр.
BS EN 60749-35:2006
Действует
Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components — 24 стр.
IEC 60749-30:2005+AMD1:2011 CSV ed1.1
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing — 28 стр.
BS EN 60749-20:2003
Заменен
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 28 стр.

На этот документ ссылаются

BS EN 60749-20:2003
Заменен
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 28 стр.
BS EN 62137-4:2014
Действует
Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices — 48 стр.
BS EN 60749-30:2005+A1:2011
Действует
Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing — 16 стр.
BS EN 60749-21:2011
Действует
Semiconductor devices. Mechanical and climatic test methods. Solderability — 24 стр.
ÖVE/ÖNORM EN 60749-30:2012-02
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011) (english version)