Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing— 16 стр.
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat— 28 стр.
Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing— 16 стр.
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat— 36 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009) (english version)
