Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat— 0 стр.
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat— 28 стр.
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat— 30 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008) (english version)
