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IEC 60749-20:2002/COR1:2003 ed1.0

Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 0 стр.
Modification of the validity date: now put at 2007.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом