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IEC 60749-20:2002/COR1:2003 ed1.0

Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 0 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60749-20:2008 ed2.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat — 53 стр.
IEC 60749-20:2002 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 49 стр.

На этот документ ссылаются

BS EN 61760-3:2010
Действует
Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering — 28 стр.
BS EN 60191-6-19:2010
Действует
Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage — 16 стр.
PD IEC/TS 62686-1:2015
Действует
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications. General requirements for high reliability integrated circuits and discrete semiconductors — 68 стр.
BS EN 61760-4:2015+A1:2018
Действует
Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices — 38 стр.
BS EN 61760-4:2015
Заменен
Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices — 36 стр.
BS EN 60068-2-58:2015
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 42 стр.
18/30379487 DC
Действует
BS EN 62435-8. Long-term storage of electronic components. Part 8. Passive electronic devices — 18 стр.
18/30379483 DC
Действует
BS EN 62435-7. Long-term storage of electronic components. Part 7. Micro-electromechanical devices — 20 стр.
18/30375624 DC
Действует
BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 39 стр.
18/30363138 DC
Действует
BS EN IEC 61760-1. Surface mounting technology. Part 1. Standard method for the specification of surface mounting components (SMDs) — 42 стр.
BS EN 60068-2-58:2015+A1:2018
Действует
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 46 стр.
BS EN IEC 62435-6:2018
Действует
Electronic components. Long-term storage of electronic semiconductor devices. Packaged or finished devices — 22 стр.
BS EN 60749-42:2014
Действует
Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage — 10 стр.
BS EN 60068-3-13:2016
Действует
Environmental testing. Supporting documentation and guidance on Test T. Soldering — 32 стр.
BS EN 60749-20-1:2009
Действует
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 36 стр.
BS EN 60749-37:2008
Действует
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer — 22 стр.
BS EN 60749-35:2006
Действует
Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components — 24 стр.
IEC 60749-20:2008 ed2.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat — 53 стр.
IEC 60749-20:2002 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 49 стр.