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BS EN 61188-5-8:2008

Действует
Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) — 34 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 61191-1:1998 ed1.0
Заменен
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies — 89 стр.
BS EN 62090:2003
Заменен
Product package labels for electronic components using bar code and two-dimensional symbologies — 50 стр.
IEC 62090:2002 ed1.0
Заменен
Product package labels for electronic components using bar code and two-dimensional symbologies — 89 стр.
BS EN 61188-5-1:2002
Действует
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Attachment (land/joint) considerations. Generic requirements — 74 стр.
IEC 61188-5-1:2002 ed1.0
Заменен
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements — 141 стр.
BS IEC 60191-2:1966
Действует
Mechanical standardization of semiconductor devices. Dimensions — 1052 стр.
BS EN 60068-2-58:2004
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 30 стр.
IEC 60068-2-58:2015 ed4.0
Действует
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 75 стр.

На этот документ ссылаются

BS EN 62137-4:2014
Действует
Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices — 48 стр.
BS EN 62137-3:2012
Действует
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints — 45 стр.
BS EN 62137-1-5:2009
Действует
Surface mounting technology. Environmental and endurance test methods for surface mount solder joints. Mechanical shear fatigue test — 28 стр.
BS EN 62137-1-4:2009
Действует
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Cyclic bending test — 18 стр.
BS EN 62137-1-3:2009
Действует
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Cyclic drop test — 26 стр.
BS EN 61188-7:2009
Заменен
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction — 22 стр.
BS EN 60068-2-21:2006
Действует
Environmental testing. Tests. Test U: Robustness of terminations and integral mounting devices — 32 стр.
ÖVE/ÖNORM EN 62137-1-5:2010-02
Действует
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009) (english version)
ÖVE/ÖNORM EN 62137-1-4:2009-10
Действует
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009) (english version)
ÖVE/ÖNORM EN 62137-1-3:2009-08
Действует
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008) (english version)