Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)— 122 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology— 26 стр.
Specifications for pressure-sensitive adhesive tapes for electrical purposes. Specifications for individual materials. PVC film tapes with pressure-sensitive adhesive— 12 стр.
Direct acting indicating analogue electrical measuring instruments and their accessories. Definitions and general requirements common to all parts— 58 стр.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly— 37 стр.
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly— 41 стр.
Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive— 15 стр.
Direct acting indicating analogue electrical measuring instruments and their accessories. Part 5: Special requirements for phase meters, power factor meters and synchroscopes— 19 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies— 26 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies, Test methods for interconnection structures (printed boards)— 62 стр.