Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste— 76 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 75 стр.
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 39 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing— 28 стр.
Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices— 37 стр.
Corrigendum 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement)— 6 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages— 42 стр.
Detail Specification. Fixed low power film resistors. Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads— 38 стр.
Detail Specification: Fixed low power film resistors. Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads— 38 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Connectors for electronic equipment. Tests and measurements. Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses— 14 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
Fixed resistors for use in electronic equipment. Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G— 48 стр.
Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses (IEC 60512-16-21:2012) (english version)
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors (IEC 60115-8:2009, modified) (english version)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009) (english version)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009) (english version)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008) (english version)
Fixed resistors for use in electronic equipment -- Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 60115-2:2014, modified) (english version)
Fixed resistors for use in electronic equipment -- Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G (IEC 60115-8-1:2014, modifiziert) (english version)
