Каталог стандартов

+7 (495) 223-46-76 +7 (812) 309-78-59
inform@normdocs.ru
О компании Стандарты Контакты Заказать стандарт
СтандартыBSI

BS EN 61760-3:2010

Действует
Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering — 28 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

BS EN 62090:2017
Действует
Product package labels for electronic components using bar code and two- dimensional symbologies — 36 стр.
BS EN 61760-2:2007
Действует
Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide — 12 стр.
BS EN 60749-20-1:2009
Действует
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 36 стр.
BS EN 60286-5:2004
Действует
Packaging of components for automatic handling. Matrix trays — 30 стр.
BS EN 60286-4:2013
Действует
Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms — 18 стр.
BS EN 60286-3:2013
Действует
Packaging of components for automatic handling. Packaging of surface mount components on continuous tapes — 44 стр.
BS EN 60194:2006
Действует
Printed board design, manufacture and assembly. Terms and definitions — 122 стр.
BS EN 60068-2-82:2007
Действует
Environmental testing. Tests. Test Tx. Whisker test methods for electronic and electric components — 36 стр.
BS EN 60068-2-77:1999
Действует
Environmental testing. Test methods. Body strength and impact shock — 16 стр.
BS EN 60068-2-58:2015
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 42 стр.
BS EN 60068-2-21:2006
Действует
Environmental testing. Tests. Test U: Robustness of terminations and integral mounting devices — 32 стр.
BS EN 60068-2-20:2008
Действует
Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads — 22 стр.
BS EN 60068-5-2:2000
Действует
Environmental testing. Guide to drafting of test methods. Terms and definitions — 18 стр.
BS EN 60062:2016
Действует
Marking codes for resistors and capacitors — 34 стр.
BS ISO 8601:2004
Действует
Data elements and interchange formats. Information interchange. Representation of dates and times — 42 стр.
IEC 62090:2002 ed1.0
Заменен
Product package labels for electronic components using bar code and two-dimensional symbologies — 89 стр.
IEC 61760-2:1998 ed1.0
Заменен
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide — 9 стр.
IEC 60749-20:2002/COR1:2003 ed1.0
Заменен
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 0 стр.
IEC 60286-5:2003 ed2.0
Заменен
Packaging of components for automatic handling - Part 5: Matrix trays — 54 стр.
IEC 60286-4:1997 ed2.0
Заменен
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G — 23 стр.
IEC 60286-3:1986 ed1.0
Заменен
Packing of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes — 10 стр.
IEC 60194:1988/COR1:1990 ed3.0
Заменен
Corrigendum 1 - Terms and definitions for printed circuits — 1 стр.
IEC 60068-2-82:2007/COR1:2009 ed1.0
Заменен
Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components — 0 стр.
IEC 60068-2-77:1999 ed1.0
Заменен
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock — 21 стр.
IEC 60068-2-58:2015 ed4.0
Действует
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 75 стр.
IEC 60068-2-45:1980/AMD1:1993 ed1.0
Действует
Amendment 1 - Basic environmental testing procedures - Part 2-45: Tests - Test XA and guidance: Immersion in cleaning solvents — 2 стр.
IEC 60068-2-21:2006/COR1:2012 ed6.0
Заменен
Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices — 0 стр.
IEC 60068-2-20A:1970 ed1.0
Заменен
Supplement A - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering - Test Tb: Resistance to soldering heat, Method 1 — 4 стр.
IEC 60068-2-83:2011 ed1.0
Действует
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste — 76 стр.
IEC 60062:1992 ed4.0
Заменен
Marking codes for resistors and capacitors — 21 стр.

На этот документ ссылаются

BS EN 60068-2-58:2015
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 42 стр.
BS EN 60068-2-58:2015+A1:2018
Действует
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 46 стр.