Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat— 0 стр.
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat— 36 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat— 63 стр.
Sampling procedures for inspection by attributes -- Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection -- Amendment 1— 8 стр.
Standard Test Methods for Determination of Nickel, Vanadium, and Iron in Crude Oils and Residual Fuels by Inductively Coupled Plasma (ICP) Atomic Emission Spectrometry— 9 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 46 стр.
