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BS EN 62137-1-3:2009

Действует
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Cyclic drop test — 26 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

BS EN 60068-2-31:2008
Действует
Environmental testing. Tests. Test Ec. Rough handling shocks, primarily for equipment-type specimens — 20 стр.
BS EN 60068-2-27:2009
Действует
Environmental testing. Tests. Test Ea and guidance. Shock — 44 стр.
IEC 60068-2-31:1969 ed1.0
Заменен
Environmental testing. Part 2: Tests. Test Ec: Drop and topple, primarily for equipment-type specimens — 7 стр.
IEC 60068-2-27:1967 ed1.0
Заменен
Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test Ea: Shock — 17 стр.
BS EN 61760-1:2006
Действует
Surface mounting technology. Standard method for the specification of surface mounting components (SMDs) — 34 стр.
BS EN 61249-2-7:2002
Действует
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad — 24 стр.
BS EN 61192-1:2003
Действует
Workmanship requirements for soldered electronic assemblies. General — 78 стр.
BS EN 61190-1-2:2007
Заменен
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly — 22 стр.
BS EN 61188-5-8:2008
Действует
Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) — 34 стр.
BS EN 60194:2006
Действует
Printed board design, manufacture and assembly. Terms and definitions — 122 стр.
IEC 61760-1:1998 ed1.0
Заменен
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) — 53 стр.
IEC 61249-2-7:2002 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad — 41 стр.
IEC 61192-1:2003 ed1.0
Отменен
Workmanship requirements for soldered electronic assemblies - Part 1: General — 147 стр.
IEC 61190-1-2:2007 ed2.0
Заменен
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 37 стр.
IEC 61188-5-3:2007 ed1.0
Действует
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides — 57 стр.
IEC 60194:1988/COR1:1990 ed3.0
Заменен
Corrigendum 1 - Terms and definitions for printed circuits — 1 стр.
IEC 60068-1:2013 ed7.0
Действует
Environmental testing - Part 1: General and guidance — 62 стр.

На этот документ ссылаются

BS EN 62878-1-1:2015
Действует
Device embedded substrate. Generic specification. Test methods — 62 стр.
BS EN 62137-4:2014
Действует
Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices — 48 стр.
BS EN 62137-3:2012
Действует
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints — 45 стр.
BS EN 62326-20:2016
Действует
Printed boards. Printed circuit boards for high-brightness LEDs — 54 стр.
ÖVE/ÖNORM EN 62137-3:2012-10
Действует
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011) (english version)