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BS EN 62435-5:2017

Действует
Electronic components. Long-term storage of electronic semiconductor devices. Die and wafer devices — 24 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

ASTM D3330/D3330M-04(2010)
Заменен
Standard Test Method for Peel Adhesion of Pressure-Sensitive Tape — 6 стр.
BS EN 62435-1:2017
Действует
Electronic components. Long-term storage of electronic semiconductor devices. General — 38 стр.
IEC 62435-1:2017 ed1.0
Действует
Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General — 65 стр.
BS EN 61340-2-1:2015
Действует
Electrostatics. Measurement methods. Ability of materials and products to dissipate static electric charge — 26 стр.
IEC 61340-2-1:2002 ed1.0
Заменен
Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge — 35 стр.
BS EN 61340-5-1:2016
Действует
Electrostatics. Protection of electronic devices from electrostatic phenomena. General requirements — 24 стр.
IEC 61340-5-1:2007 ed1.0
Заменен
Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements — 38 стр.
BS EN 60749-22:2003
Действует
Semiconductor devices. Mechanical and climatic test methods. Bond strength — 24 стр.
IEC 60749-22:2002/COR1:2003 ed1.0
Действует
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength — 0 стр.
BS EN 60749-21:2011
Действует
Semiconductor devices. Mechanical and climatic test methods. Solderability — 24 стр.
IEC 60749-21:2004 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability — 45 стр.
BS EN 60749-20-1:2009
Действует
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 36 стр.
IEC 60749-20-1:2009 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 63 стр.
BS EN 60749-3:2017
Действует
Semiconductor devices. Mechanical and climatic test methods. External visual examination — 16 стр.
IEC 60749-30:2005+AMD1:2011 CSV ed1.1
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing — 28 стр.
BS EN 60068-2-20:2008
Действует
Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads — 22 стр.
IEC 60068-2-20A:1970 ed1.0
Заменен
Supplement A - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering - Test Tb: Resistance to soldering heat, Method 1 — 4 стр.
BS EN 60068-2-17:1995
Действует
Environmental testing. Test methods, Test Q. Sealing — 44 стр.
IEC 60068-2-17:1994 ed4.0
Заменен
Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing — 52 стр.
BS EN 62435-2:2017
Действует
Electronic components. Long-term storage of electronic semiconductor devices. Deterioration mechanisms — 24 стр.
IEC 62435-2:2017 ed1.0
Действует
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms — 36 стр.

На этот документ ссылаются

BS EN 15033:2006
Действует
Room sealed storage water heaters for the production of sanitary hot water using LPG for vehicles and boats — 64 стр.
BS EN IEC 62435-6:2018
Действует
Electronic components. Long-term storage of electronic semiconductor devices. Packaged or finished devices — 22 стр.