Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 38 стр.
Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method— 28 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)— 122 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 40 стр.
