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BS IEC 61189-5-4:2015

Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies — 26 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

ASTM B362-91(2008)
Заменен
Standard Test Method for Mechanical Torque Rate of Spiral Coils of Thermostat Metal — 3 стр.
ISO 9455-2:1993
Действует
Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method — 8 стр.
ISO 9455-1:1990
Действует
Soft soldering fluxes; test methods; part 1: determination of non-volatile matter, gravimetric method — 5 стр.
BS ISO 5725-2:1994
Действует
Accuracy (trueness and precision) of measurement methods and results. Basic methods for the determination of repeatability and reproducibility of a standard measurement method — 62 стр.
BS IEC 61189-5-2:2015
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies — 44 стр.

На этот документ ссылаются

DIN EN 61189-5-2:2015-11
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015 — 44 стр.
DIN EN 61189-5-4:2015-11
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015 — 25 стр.
DIN EN 61189-5-3:2015-11
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015 — 45 стр.
DIN EN 62137-4:2015-07
Действует
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015 — 44 стр.
DIN EN 62137:2005-04
Отменен
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004 — 29 стр.
DIN EN 61189-5-1:2017-04
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016 — 27 стр.
DIN EN IEC 61190-1-3:2018-09
Действует
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 — 44 стр.
DIN EN 61190-1-3:2011-04
Отменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010 — 41 стр.
ÖVE/ÖNORM EN 61190-1-3:2011-05
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010) (english version)