Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Preparation for a lead-free control plan— 36 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 35 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 89 стр.
