Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G (IEC 60286-4:1997); German version EN 60286-4:1998— 12 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011— 11 стр.
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2011); German version EN 61709:2011— 88 стр.
Semiconductor devices - Part 16-3: Microwave integrated circuits; Frequency converters (IEC 60747-16-3:2002); German version EN 60747-16-3:2002— 44 стр.
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286-4:2013); German version EN 60286-4:2013— 18 стр.
Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical (IEC 61747-10-1:2013); German version EN 61747-10-1:2013— 14 стр.
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2009); German version EN 62148-15:2010— 17 стр.
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010— 22 стр.
Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication (IEC 62572-3:2011); German version EN 62572-3:2012— 21 стр.
Industrial systems, installations and equipment and industrial products - Designation of signals - Part 1: Basic rules (IEC 61175-1:2015); German version EN 61175-1:2015— 53 стр.
Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication (IEC 62572-3:2016); German version EN 62572-3:2016— 23 стр.
Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication (IEC 62572-3:2014); German version EN 62572-3:2014— 21 стр.
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009); German version EN 60747-16-3:2002 + A1:2009— 46 стр.
Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods (IEC 61360-1:2017); German version EN 61360-1:2017— 181 стр.
Terminology for voltage-sourced converters (VSC) for high-voltage direct current (HVDC) systems (IEC 62747:2014); German version EN 62747:2014— 32 стр.
