Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-8:2003); German version EN 61249-2-8:2003— 24 стр.
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004— 27 стр.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007— 22 стр.
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-22:2005); German version EN 61249-2-22:2005— 25 стр.
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 61249-2-30:2012); German version EN 61249-2-30:2013— 23 стр.
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-38:2008); German version EN 61249-2-38:2009— 25 стр.
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad (IEC 61249-2-2:2005); German version EN 61249-2-2:2005— 18 стр.
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-16:2009); German version EN 61249-4-16:2009— 15 стр.
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003— 64 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 9: Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in) (IEC 60603-9:1990); German version EN 60603-9:1998— 58 стр.
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-1:2008); German version EN 61249-4-1:2008— 14 стр.
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007); German version EN 61193-2:2007— 20 стр.
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad (IEC 61249-2-1:2005); German version EN 61249-2-1:2005— 17 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features (IEC 60603-2:1995); German version EN 60603-2:1998— 73 стр.
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-11:2003); German version EN 61249-2-11:2003— 24 стр.
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-14:2009); German version EN 61249-4-14:2009— 15 стр.
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-18:2013); German version EN 61249-4-18:2013— 15 стр.
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010— 42 стр.
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007); German version EN 61192-5:2007— 41 стр.
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-12:2005); German version EN 61249-4-12:2005— 14 стр.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014— 24 стр.
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-21:2003); German version EN 61249-2-21:2003— 24 стр.
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008— 20 стр.
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-10:2003); German version EN 61249-2-10:2003— 25 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 3: Two-part connectors for printed boards having contacts spaced at 2,54 mm (O,1 in) centres and staggered terminations at that same spacing (IEC 60603-3:1987); German version EN 60603-3:1998— 17 стр.
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006— 31 стр.
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013— 67 стр.
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-11:2005); German version EN 61249-4-11:2005— 14 стр.
Workmanship requirements for soldered electric assemblies - Part 3: Through-hole mount assemblies (IEC 61192-3:2002); German version EN 61192-3:2003— 46 стр.
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-5:2003); German version EN 61249-2-5:2003— 22 стр.
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35:2008); German version EN 61249-2-35:2009— 26 стр.
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-42:2010); German version EN 61249-2-42:2010— 24 стр.
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011— 36 стр.
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad (IEC 61249-2-23:2005); German version EN 61249-2-23:2005— 19 стр.
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012); German version EN 61182-2-2:2012— 49 стр.
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-6:2003); German version EN 61249-2-6:2003— 22 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013— 17 стр.
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-41:2010); German version EN 61249-2-41:2010— 24 стр.
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-37:2008); German version EN 61249-2-37:2009— 25 стр.
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008); German version EN 61249-2-36:2009— 26 стр.
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (IEC 61249-4-5:2005); German version EN 61249-4-5:2005— 14 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 4: Two-part connectors for printed boards having contacts spaced at 1,91 mm (0,075 in) centres and staggered terminations at that same spacing (IEC 60603-4:1987); German version EN 60603-4:1998— 18 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 8: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), with square male contacts of 0,63 mm Ч 0,63 mm (IEC 60603-8:1990); German version EN 60603-8:1998— 42 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007— 39 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features (IEC 60603-2:1995 + A1:2000); German version EN 60603-2:1998 + A1:2005— 93 стр.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010— 26 стр.
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009); German version EN 61249-4-17:2009— 15 стр.
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002— 23 стр.
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-26:2005); German version EN 61249-2-26:2005— 23 стр.
Connectors for frequencies below 3 MHz for use with printed boards; part 7: detail specification for connectors, 8-way, including fixed and free connectors with common mating features (IEC 60603-7:1990); German version EN 60603-7:1993— 60 стр.
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-19:2013); German version EN 61249-4-19:2013— 15 стр.
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:1998); German version EN 61760-1:1998— 18 стр.
Connectors for frequencies below 3 MHz for use with printed boards - Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type (IEC 60603-10:1991); German version EN 60603-10:1998— 26 стр.
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-40:2012); German version EN 61249-2-40:2013— 25 стр.
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012); German version EN 61249-2-39:2013— 25 стр.
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-15:2009); German version EN 61249-4-15:2009— 15 стр.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 62137-1-1:2007); German version EN 62137-1-1:2007— 18 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013); German version EN 62739-1:2013— 19 стр.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 62137-1-2:2007); German version EN 62137-1-2:2007— 19 стр.
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015— 44 стр.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009— 15 стр.
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012— 47 стр.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5: Mechanical shear fatigue test (IEC 62137-1-5:2009); German version EN 62137-1-5:2009— 24 стр.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009— 24 стр.
Detail specification - Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75101-801, with assessed quality; German version EN 175101-809:2004— 41 стр.
Detail specification - Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75101-801, with assessed quality; German version EN 175101-809:1999— 32 стр.
Detail specification - Two-part-connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows; German version EN 175101-802:1999— 46 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016— 13 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (IEC 62739-2:2016); German version EN 62739-2:2016— 18 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016— 20 стр.
Product package labels for electronic components using bar code and two- dimensional symbologies (IEC 62090:2017); German version EN 62090:2017— 34 стр.
Product package labels for electronic components using bar code and two-dimensional symbologies (IEC 62090:2002); German version EN 62090:2003— 44 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (IEC 62739-3:2017); German version EN 62739-3:2017— 34 стр.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017— 27 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018— 44 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010— 41 стр.
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018— 9 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013); German version EN 61191-1:2013— 51 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018— 49 стр.
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017— 36 стр.
