Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004— 27 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (IEC 60749-42:2014); German version EN 60749-42:2014— 10 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009); German version EN 60749-20-1:2009— 39 стр.
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010— 15 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011— 14 стр.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010); German version EN 61760-3:2010— 26 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005); German version EN 60749-30:2005— 15 стр.
Fibre optic active components and devices - Performance standards - Part 2:850 nm discrete vertical cavity surface emitting laser devices (IEC 62149-2:2009); German version EN 62149-2:2009— 21 стр.
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010— 22 стр.
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015— 44 стр.
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004— 29 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017— 9 стр.
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015); German version EN 61760-4:2015— 34 стр.
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018— 38 стр.
