DIN EN 62148-17:2014-09

Действует

Fiber optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors (IEC 62148-17:2013); German version EN 62148-17:2014 — 17 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

BS IEC 60191-1:2007

Заменен

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices — 40 стр.

BS IEC 60191-2:1966

Действует

Mechanical standardization of semiconductor devices. Dimensions — 1052 стр.

DIN IEC 60191-4:2010-07

Отменен

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)

DIN IEC 60191-6-1:2010-07

Отменен

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)

DIN IEC 60191-6-21:2009-02

Отменен

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)

DIN IEC 60191-6-5:2010-01

Отменен

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)

DIN IEC 60191-6-12:2010-04

Отменен

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)

DIN IEC 60191-6-17:2007-10

Отменен

Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)

DIN IEC 60191-6-18:2008-03

Отменен

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007)

DIN IEC 60191-6-19:2008-03

Отменен

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)

DIN IEC 60191-6-20:2009-02

Отменен

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)

DIN IEC 60874-19-3:2007-03

Отменен

Connectors for optical fibres and cables - Part 19-3: Fibre optic adaptor (duplex) type SC for multimode fibre connectors - Detail specification (IEC 86B/2401/CDV:2006)

DIN IEC 62148-16:2008-02

Отменен

Fiber optic active components and devices - Package and interface standards - Part 16: Transmitter and Receiver components for LC connector interface (IEC 86C/790/CD:2007)

DIN EN ISO 1101:2014-04

Отменен

Geometrical product specifications (GPS) - Geometrical tolerancing - Tolerances of form, orientation, location and run-out (ISO 1101:2012 + Cor. 1:2013); German version EN ISO 1101:2013 — 116 стр.

DIN EN 62148-17:2012-03

Отменен

Fiber optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors (IEC 86C/1046/CD:2011)