Rules of procedure for the IEC Quality Assessment System for electronic components (IECQ) - Part 3: Approval procedures; technology Approval (IEC QC 001002-3:1995)
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2006); German version EN 61760-1:2006— 31 стр.
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007); German version EN 61193-2:2007— 20 стр.
Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components (IEC 60286-6:2004); German version EN 60286-6:2004— 15 стр.
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
Basic environmental testing procedures; part 2: tests; test XA and guidance: immersion in cleaning solvents (IEC 60068-2-45:1980 + A1:1993); German version EN 60068-2-45:1992 + A1:1993— 7 стр.
Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) (IEC 60068-2-30:2005); German version EN 60068-2-30:2005— 15 стр.
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (IEC 60068-2-21:2006); German version EN 60068-2-21:2006— 32 стр.
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008, Corrigendum to DIN EN 60068-2-20:2009-02— 2 стр.
Letter symbols to be used in electrical technology - Part 1: General (IEC 60027-1:1995 (Reprint) + A1:1997 + A2:2005); German version EN 60027-1:2006 + A2:2007— 89 стр.
Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version EN 140401-803:2007/FprAB:2012
