This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD).
This standard provides procedures for determining the solderability and resistance to
soldering heat of devices in applications using solder alloys, which are eutectic or near
eutectic tin lead (Pb), or lead-free alloys.
The procedures use either a solder bath or reflow method and are applicable only to
specimens or products designed to withstand short term immersion in molten solder or limited
exposure to reflow systems.
The solder bath method is applicable to SMDs designed for flow soldering and SMDs
designed for reflow soldering when the solder bath (dipping) method is appropriate.
The reflow method is applicable to the SMD designed for reflow soldering, to determine the
suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not
appropriate.
The objective of this standard is to ensure solderability of component lead or termination. In
addition, test methods are provided to ensure that the component body can resist against the
heat load to which it is exposed during soldering.
This standard covers tests Td1, Td2 and Td3 as listed below:
Number of Td Test Method
Td1 Solderability of terminations
Method 1: Solder bath
Method 2: Reflow
Td2 Resistance to soldering heat
Method 1: Solder bath
Method 2: Reflow
Td3 Dewetting and resistance to dissolution of metallization
Method 1: Solder bath
Method 2: Reflow
NOTE 1 For specific components other test methods may exist.
NOTE 2 Test Td does not apply to printed wiring board (PWB), see IEC 61189-3.
NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow
soldering) are also included in this standard.