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ÖVE/ÖNORM EN 60068-2-58:2016-03

Заменен
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60068-1:2013 ed7.0
Действует
Environmental testing - Part 1: General and guidance — 62 стр.
IEC 61191-2:2017 ed3.0
Действует
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies — 33 стр.
IEC 61249-2-22:2005 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad — 49 стр.
IEC 61249-2-35:2008 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly — 46 стр.
IEC 60068-2-20:2008 ed5.0
Заменен
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads — 40 стр.
IEC 61760-1:2006 ed2.0
Заменен
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) — 60 стр.
ISO 9454-2:1998
Действует
Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements — 12 стр.
ÖNORM EN ISO 9454-2:2000-07
Заменен
Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
IEC 60194:2015 ed6.0
Заменен
Printed board design, manufacture and assembly - Terms and definitions — 524 стр.
IEC 61190-1-1:2002 ed1.0
Действует
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly — 41 стр.
IEC 61190-1-2:2014 ed3.0
Действует
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 46 стр.
IEC 61190-1-3:2007+AMD1:2010 CSV ed2.1
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 85 стр.
IEC 61190-1-3:2007/AMD1:2010 ed2.0
Заменен
Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 17 стр.
IEC 61190-1-3:2007 ed2.0
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 71 стр.
ÖVE/ÖNORM EN 60068-2-5:2011-11
Заменен
Environmental testing - Part 2-5: Tests - Test Sa: Simulated solar radiation at ground level and guidance for solar radiation testing (IEC 60068-2-5:2010 + corrigendum Dec. 2010) (english version)

На этот документ ссылаются

DIN EN 60115-8-1:2016-03
Действует
Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G (IEC 60115-8-1:2014, modified); German version EN 60115-8-1:2015 — 47 стр.
DIN EN 60115-1:2016-03
Действует
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2008, modified); German version EN 60115-1:2011 + A11:2015 — 92 стр.
DIN EN 60115-1:2012-04
Отменен
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2008, modified); German version EN 60115-1:2011 — 93 стр.
DIN EN 140402-801:2015-12
Действует
Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2; German version EN 140402-801:2015 — 45 стр.
DIN EN 60862-1:2004-03
Отменен
Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification (IEC 60862-1:2003); German version EN 60862-1:2003 — 41 стр.
DIN EN 16704-2-1:2017-03
Действует
Railway applications - Track - Safety protection on the track during work - Part 2-1: Common solutions and technologies - Technical requirements for Track Warning Systems (TWS); German version EN 16704-2-1:2016 — 32 стр.
DIN EN 140401-803:2013-12
Отменен
Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version EN 140401-803:2007 + A1:2010 + A2:2013 — 40 стр.
DIN EN 140402:2017-07
Действует
Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistors; German version EN 140402:2015 + A1:2016 — 37 стр.
DIN EN 140402:2015-12
Отменен
Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistors; German version EN 140402:2015 — 35 стр.
DIN EN 140401-802:2014-09
Отменен
Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2; German version EN 140401-802:2007 + A1:2010 + A2:2013 — 39 стр.
DIN EN 140401-802:2017-09
Действует
Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2; German version EN 140401-802:2007 + A1:2010 + A2:2013 + A3:2017 — 40 стр.