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IEC 60191-6-3:2000 ed1.0

Действует
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) — 34 стр.
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом