IEC 60191-6-3:2000 ed1.0

Действует

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) — 34 стр.

Описание Изменения Ссылки Версии

На этот документ ссылаются

DIN EN 62148-18:2015-09

Действует

Fibre optic active components and devices - Package and interface standards - Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector (IEC 62148-18:2014); German version EN 62148-18:2015 — 34 стр.

BS EN IEC 60191-1:2018

Действует

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices — 44 стр.

DIN EN IEC 60191-1:2018-10

Действует

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018 — 41 стр.

DIN EN IEC 62148-1:2019-02

Действует

Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance (IEC 62148-1:2017); German version EN IEC 62148-1:2018 — 13 стр.

DIN EN 62148-15:2015-03

Отменен

Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2014); German version EN 62148-15:2014 — 23 стр.