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IEC 60749-14:2003 ed1.0

Действует
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) — 27 стр.
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом