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IEC 60749-15:2003 ed1.0

Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 11 стр.
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом