IEC 60749-15:2003 ed1.0

Заменен

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 11 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 60749-15:2010 ed2.0

Заменен

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 14 стр.

IEC PAS 62174:2000 ed1.0

Заменен

Resistance to soldering temperature for through-hole mounted devices — 5 стр.

На этот документ ссылаются

PD IEC/TS 62686-1:2015

Действует

Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications. General requirements for high reliability integrated circuits and discrete semiconductors — 68 стр.

BS EN 60749-21:2011

Действует

Semiconductor devices. Mechanical and climatic test methods. Solderability — 24 стр.

BS EN 60747-15:2012

Действует

Semiconductor devices. Discrete devices. Isolated power semiconductor devices — 28 стр.

IEC 60749-15:2010 ed2.0

Заменен

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 14 стр.

IEC PAS 62174:2000 ed1.0

Заменен

Resistance to soldering temperature for through-hole mounted devices — 5 стр.