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IEC PAS 62174:2000 ed1.0

Заменен
Resistance to soldering temperature for through-hole mounted devices — 5 стр.
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом