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IEC 60749-15:2010 ed2.0

Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 14 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60749-15:2020 ed3.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 17 стр.
IEC 61760-1:2006 ed2.0
Заменен
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) — 60 стр.
IEC 60749-15:2003 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 11 стр.

На этот документ ссылаются

DIN EN 62149-2:2010-05
Отменен
Fibre optic active components and devices - Performance standards - Part 2:850 nm discrete vertical cavity surface emitting laser devices (IEC 62149-2:2009); German version EN 62149-2:2009 — 21 стр.
IEC 60749-15:2003 ed1.0
Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices — 11 стр.
IEC 61496-2:2013 ed3.0
Заменен
Safety of machinery - Electro-sensitive protective equipment - Part 2: Particular requirements for equipment using active opto-electronic protective devices (AOPDs) — 104 стр.