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IEC 60749-3:2002 ed1.0

Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection — 7 стр.
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом