Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing— 28 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing— 26 стр.
Fibre optic active components and devices - Performance standards - Part 2:850 nm discrete vertical cavity surface emitting laser devices (IEC 62149-2:2009); German version EN 62149-2:2009— 21 стр.
BS EN 60747-18-2. Semiconductor devices. Part 18-2. Semiconductor bio sensors. Evaluation process of lens-free CMOS photonic array sensor package module— 19 стр.
Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated HC MOS circuits series HC/HCT/HCU— 44 стр.
Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced SCHOTTKY digital integrated circuits series 54 AS, 74 AS— 32 стр.
Specification for harmonized system of quality assessment for electronic components. Family specification. TTL FAST digital integrated circuits series 54 F, 74 F— 36 стр.
Specification for harmonized system of quality assessment for electronic components. Family specification. TTL advanced low power SCHOTTKY digital integrated circuits series 54 ALS, 74 ALS— 34 стр.
Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL low power SCHOTTKY, circuits, series 54LS, 64LS, 74LS, 84LS— 26 стр.
Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL-SCHOTTKY circuits, series 54S, 64S, 74S, 84S— 36 стр.
Specification for harmonized system of quality assessment for electronic components. Family specification: digital integrated TTL circuits series 54, 64, 74, 84— 36 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated operational amplifiers— 40 стр.
Specification for harmonized system of quality assessment for electronic components. Blank detail specification: integrated voltage regulators— 38 стр.
Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCU— 32 стр.
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications. General requirements for high reliability integrated circuits and discrete semiconductors— 68 стр.
BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat— 39 стр.
BS EN 61643-321 Ed.2.0. Components for low-voltage surge protective devices. Part 321. Performance requirements and test circuits for silicon PN-junction voltage limiters— 27 стр.
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat— 36 стр.
Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat— 30 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing— 26 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009) (english version)
