Каталог стандартов

+7 (495) 223-46-76 +7 (812) 309-78-59
inform@normdocs.ru

IEC 60749-34:2004 ed1.0

Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling — 21 стр.
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом