IEC 61189-5-2:2015 ed1.0

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies — 83 стр.

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BS EN 61189-5-1:2016

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies — 32 стр.

BS EN IEC 61190-1-3:2018

Действует

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications — 48 стр.