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IEC 61189-5-4:2015 ed1.0

Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies — 45 стр.
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На этот документ ссылаются

BS EN 62137:2004
Заменен
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN — 30 стр.
BS EN 61189-5-1:2016
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies — 32 стр.
BS EN IEC 61190-1-3:2018
Действует
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications — 48 стр.