Каталог стандартов

+7 (495) 223-46-76 +7 (812) 309-78-59
inform@normdocs.ru
О компании Стандарты Контакты Заказать стандарт
СтандартыIEC

IEC 61189-5-503:2017 ed1.0

Действует
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards — 23 стр.
ОписаниеИзмененияСсылкиВерсии

На этот документ ссылаются

BS EN 62137-4:2014
Действует
Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices — 48 стр.
BS EN 61190-1-1:2002
Действует
Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly — 26 стр.
BS EN 61189-5-4:2015
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies — 26 стр.
BS EN 61189-5-3:2015
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies — 46 стр.
BS EN 61189-5-2:2015
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies — 46 стр.
BS EN 61189-5-1:2016
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies — 32 стр.
BS EN 61190-1-3:2007+A1:2010
Заменен
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 40 стр.
BS EN IEC 61190-1-3:2018
Действует
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications — 48 стр.
DIN EN IEC 61190-1-3:2018-09
Действует
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 — 44 стр.