Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates— 20 стр.
BS IEC 62047-31. Semiconductor devices. Micro-electromechanical devices. Part 31. Four-point bending test method for interfacial adhesion energy of layered MEMS materials— 14 стр.
BS EN IEC 63203-401-1. Wearable electronic devices and technologies. Part 401-1. Devices and Systems. Functional elements. Evaluation method of the stretchable resistive strain sensor— 15 стр.
