Стандарты IEC

IEC 62090:2002 ed1.0

Заменен

Product package labels for electronic components using bar code and two-dimensional symbologies — 89 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 62090:2017 ed2.0

Действует

Product package labels for electronic components using bar code and two-dimensional symbologies — 31 стр.

На этот документ ссылаются

IEC 62090:2017 ed2.0

Действует

Product package labels for electronic components using bar code and two-dimensional symbologies — 31 стр.

BS EN 61760-3:2010

Действует

Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering — 28 стр.

BS EN 61188-5-8:2008

Действует

Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) — 34 стр.

BS ISO 22742:2010

Действует

Packaging. Linear bar code and two-dimensional symbols for product packaging — 56 стр.

18/30355702 DC

Действует

BS EN 60115-1. Fixed resistors for use in electronic equipment. Part 1. Generic specification — 140 стр.

PD IEC/TS 62647-4:2018

Действует

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling — 44 стр.

18/30363138 DC

Действует

BS EN IEC 61760-1. Surface mounting technology. Part 1. Standard method for the specification of surface mounting components (SMDs) — 42 стр.

BS EN 61760-1:2006

Действует

Surface mounting technology. Standard method for the specification of surface mounting components (SMDs) — 34 стр.

ÖVE/ÖNORM EN 61760-3:2011-01

Действует

Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) (english version)