Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Performance testing for systems containing lead-free solder and finishes— 44 стр.
BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards— 34 стр.
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014) (english version)
