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IEC PAS 60191-6-18:2008 ed1.0

Заменен
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) — 19 стр.
This PAS provides common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом