Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method— 28 стр.
Protection of metallic materials against corrosion. Guidance on the assessment of corrosion likelihood in water distribution and storage systems. Influencing factors for copper and copper alloys— 20 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 40 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications— 48 стр.
Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method— 58 стр.
Solder wire, solid and flux cored - Specification and tests methods - Part 3: Wetting balance test method for flux cored solder wire efficacy (ISO 12224-3:2003)
