Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) (english version)
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014) (english version)