ÖVE/ÖNORM EN 60068-2-20:2009-03

Действует

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008) (english version)

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 60068-1:1960/AMD2:1964 ed2.0

Заменен

Amendment 2 - Recommended basic climatic and mechanical robustness testing procedure for components for electronic equipment - Part 1: General — 10 стр.

IEC 60068-2-2:1974/AMD1:1993 ed4.0

Заменен

Amendment 1 - Basic environmental testing procedures - Part 2-2: Tests - Tests B: Dry heat — 2 стр.

IEC 60068-2-66:1994 ed1.0

Действует

Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) — 33 стр.

IEC 60068-2-78:2012 RLV ed2.0

Действует

Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state — 29 стр.

IEC 60194:2015 ed6.0

Заменен

Printed board design, manufacture and assembly - Terms and definitions — 524 стр.

IEC 61191-3:1998 ed1.0

Заменен

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies — 31 стр.

IEC 61191-4:1998 ed1.0

Заменен

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies — 33 стр.

BS EN 60068-2-2:2007

Действует

Environmental testing. Tests. Test B. Dry heat — 18 стр.

BS EN 60194:2006

Действует

Printed board design, manufacture and assembly. Terms and definitions — 122 стр.