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ÖVE/ÖNORM EN 60068-2-83:2012-08

Действует
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011) (english version)
This part of IEC 60068 provides methods for comparative investigation of the wettability of the
metallic terminations or metallized terminations of SMDs with solder pastes.
Data obtained by these methods are not intended to be used as absolute quantitative data for
pass – fail purposes.
ICS
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
19.040 Environmental. Including testing equipment / Климатические испытания. Включая испытательное оборудование