Каталог стандартов

+7 (495) 223-46-76 +7 (812) 309-78-59
inform@normdocs.ru
О компании Стандарты Контакты Заказать стандарт
СтандартыON

ÖVE/ÖNORM EN 60068-2-83:2012-08

Действует
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011) (english version)
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60068-1:1960/AMD2:1964 ed2.0
Заменен
Amendment 2 - Recommended basic climatic and mechanical robustness testing procedure for components for electronic equipment - Part 1: General — 10 стр.
IEC 60068-2-20:2008 ed5.0
Заменен
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads — 40 стр.
IEC 60068-2-58:2004 ed3.0
Заменен
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 53 стр.
IEC 60194:2015 ed6.0
Заменен
Printed board design, manufacture and assembly - Terms and definitions — 524 стр.
IEC 61190-1-3:2007+AMD1:2010 CSV ed2.1
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 85 стр.
BS EN 60068-1:2014
Действует
Environmental testing. General and guidance — 36 стр.
BS EN 60068-2-20:2008
Действует
Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads — 22 стр.
BS EN 60068-2-58:2015
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 42 стр.
BS EN 60194:2006
Действует
Printed board design, manufacture and assembly. Terms and definitions — 122 стр.
BS EN 61190-1-3:2007
Действует
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 38 стр.