Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) (english version)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat— 49 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 42 стр.
Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat— 36 стр.