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ÖVE/ÖNORM EN 62047-10:2012-05

Действует
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011) (english version)
This part of IEC 62047 specifies micro-pillar compression test method to measure
compressive properties of MEMS materials with high accuracy, repeatability, and moderate
effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a
specimen is measured, and the compressive modulus of elasticity and yield strength can be
obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micromachining
technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be
more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
ICS
31.080.99 Other semiconductor devices / Полупроводниковые приборы прочие