This part of IEC 62047 describes definitions and procedures for measuring the forming limit of
metallic film materials with a thickness range from 0,5 µm to 300 µm. The metallic film
materials described herein are typically used in electric components, MEMS and microdevices.
When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by
a forming process such as imprinting, it is necessary to predict the material failure in order to
increase the reliability of the components. Through this prediction, the effectiveness of
manufacturing MEMS components by a forming process can also be improved, because the
period of developing a product can be reduced and manufacturing costs can thus be
decreased. This standard presents one of the prediction methods for material failure in
imprinting process.