Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006— 12 стр.
Film and hybrid integrated circuits - Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers; German version EN 165000-3:1996— 95 стр.
Film and hybrid integrated circuits - Part 4: Customer information, product assessment level schedules and blank detail specification; German version EN 165000-4:1996— 43 стр.
Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)— 15 стр.