Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996); German version EN 60512-12-6:1996— 6 стр.
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test: 20b: Flammability tests; Fireproofness (IEC 60512-20-2:2000); German version EN 60512-20-2:2000— 10 стр.
Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores (IEC 61797-1:1996); German version EN 61797-1:1996— 23 стр.
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests; section 5: Test 6e: Random vibration (IEC 60512-6-5:1997, modified); German version EN 60512-6-5:1999— 8 стр.
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19: Chemical resistance tests; section 3: Test 19c: Fluid resistance (IEC 60512-19-3:1997); German version EN 60512-19-3:1997— 5 стр.
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General examination; Section 3: Test 1c: Electrical engagement length (IEC 60512-1-3:1997); German version EN 60512-1-3:1997— 4 стр.
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 8: Test 11h: Sand and dust (IEC 60512-11-8:1995); German version EN 60512-11-8:1999— 4 стр.
Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method (IEC 60512-12-7:2001); German version EN 60512-12-7:2001— 7 стр.
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General; Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997— 4 стр.
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014— 16 стр.
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011— 31 стр.
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014— 11 стр.
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015— 28 стр.
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012— 20 стр.
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012— 17 стр.
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010— 17 стр.
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010— 22 стр.
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011— 30 стр.
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015— 13 стр.
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011— 26 стр.
